专利名称：Thermoforming device, mold assembly,
mold, and method
发明人：Erwin Wabnig,Thomas Halletz申请号：US15594172申请日：20170512公开号：US09931782B2公开日：20180403
专利附图：
摘要：A thermoforming device is described. It relates to a mold assembly including afirst and second mold, and to a mold that can be used in a thermoforming device. It alsorelates to a method for thermoforming a product. The thermoforming device is
characterized in that the thermoforming device comprises a second pre-stretcher, inaddition to a first pre-stretcher and a calibration element, and that the second pre-stretcher is at least partially and moveably arranged in a second mold body. A movementrelative to the second mold body and towards the same forming cavity of the first pre-stretcher, the second pre-stretcher, and the calibration element, can be individuallycontrolled, and the second pre-stretcher at least partially surrounds the first pre-stretcher and the calibration element.
申请人：KIEFEL GmbH
地址：Freilassing DE
国籍：DE
代理机构：Cantor Colburn LLP
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